Indalloy®301 LT: Revolutionizing Power Module Package-Attach Soldering
Charged
FEBRUARY 6, 2024
This novel alloy technology is specifically designed for power module package-attach applications and enables lower processing temperatures in preform soldering. When leveraged with this new alloy technology, preform soldering can prevent issues like warpage, encapsulation breakdown, and delamination by reducing processing temperature.
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