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Littelfuse introduces automotive-grade 3 kA high-surge AC current protector for EVs

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The Pxxx0S3N-A Automotive Grade SIDACtor Protection Thyristor Series in DO-214AB (SMC) package offers high power density and can withstand surge currents up to 3 kA (8/20 µs) and voltages up to 6 kV with low clamping voltage. The Pxxx0S3N-A Series SIDACtor Protection Thyristors are available in tape-and-reel quantities of 3,000.

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Toshiba releases new photovoltaic photocoupler for automotive solid-state relays

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Toshiba has introduced a photovoltaic output photocoupler for solid-state relays for automotive equipment with improved minimum open voltage. Compact surface-mount 4-pin SO6 packaging (3.7 The coupler can be used for automotive equipment such as battery management systems, onboard chargers and inverters.

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Toshiba’s new high-voltage automotive photorelay detects relay sticking and ground faults

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Toshiba Electronic Devices & Storage has launched a new photorelay that’s designed for high-voltage automotive batteries, battery voltage monitoring, and the detection of mechanical relay sticking and ground faults. High-voltage MOSFETs facilitate a high-output withstand voltage of 1,500 V. It’s available now.

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Infineon launches new 750 V IGBTs for automotive traction inverters

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German semiconductor manufacturer Infineon has launched two new 750 V insulated-gate bipolar transistors (IGBTs) designed for discrete traction inverters in automotive applications. Housed in a TO-247PLUS package, the new IGBTs support battery voltages up to 470 V, and are available now. Source: Infineon.

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Nexperia extends MOSFET line-up with AEC-Q101-qualified half-bridge package

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Nexperia has announced a series of half-bridge (high-side and low-side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications, including motor drives and DC/DC converters.

Packaging 101
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Identifying the root cause of particle contamination in electronic automotive components

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Production processes, the production environment, and the final packaging all have an influence on component cleanliness. Though this issue is primarily associated with the automotive industry at present, it is also of wider relevance for many other industries. The quality solution: technical cleanliness.

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Nexperia’s new 40 V MOSFETs for automotive and industrial applications

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R DS(on) 40 V power MOSFETs in the LFPAK88 package for automotive (BUK7S0R5-40H) and industrial (PSMNR55-40SSH) applications. The resulting low R DS(on) enables us to pack more silicon in the package, improving power density and shrinking device footprint.”. Nexperia has announced new 0.55 Measuring 8x8x1.7